Post by account_disabled on Dec 28, 2023 3:08:11 GMT -5
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) takes another step forward in developing the smallest power supplies for automotive electronics applications. The company is the first chip manufacturer to begin manufacturing and packaging flip-chip packages that meet quality requirements and meet the needs of the automotive market specifically. Infineon is now ready to launch the product.The first product from this manufacturing process is a linear voltage regulator model OPTIREG(TM) TLS715B0NAV50.
To manufacture chips with flip-chip B2B Email List technology, integrated circuits (ICs) are placed face down in a package. By having the heated portion of the IC closer to the PCB, thermal conductivity can be increased by a factor of 2-3. The higher power density supports much smaller devices than conventional technology. Packed with original chips The package size of Infineon's new linear voltage regulator (TSNP-7-8 package, 2.0 mm x 2.0 mm) is 60% smaller than the reference product on the market (TSON-10 package). , 3.3 mm x 3.3 mm) while maintaining the same heat resistance performance as before. Such features make this newly launched product Ideal for use with boards with very limited space, such as radars and cameras.
OPTIREG TLS715B0NAV50 Provides a voltage of 5 V and a maximum current of 150 mA. Flip-chip technology has long been widely used in consumer and industrial markets. However, due to increasingly stringent space requirements, This is especially true in radar and camera systems. Make power supplies smaller But the quality is much higher. It has become a demand for applications in automotive electronics systems. Infineon is not just improving the features of existing industrial and consumer products. But it has also developed a production process specifically for automotive equipment.
To manufacture chips with flip-chip B2B Email List technology, integrated circuits (ICs) are placed face down in a package. By having the heated portion of the IC closer to the PCB, thermal conductivity can be increased by a factor of 2-3. The higher power density supports much smaller devices than conventional technology. Packed with original chips The package size of Infineon's new linear voltage regulator (TSNP-7-8 package, 2.0 mm x 2.0 mm) is 60% smaller than the reference product on the market (TSON-10 package). , 3.3 mm x 3.3 mm) while maintaining the same heat resistance performance as before. Such features make this newly launched product Ideal for use with boards with very limited space, such as radars and cameras.
OPTIREG TLS715B0NAV50 Provides a voltage of 5 V and a maximum current of 150 mA. Flip-chip technology has long been widely used in consumer and industrial markets. However, due to increasingly stringent space requirements, This is especially true in radar and camera systems. Make power supplies smaller But the quality is much higher. It has become a demand for applications in automotive electronics systems. Infineon is not just improving the features of existing industrial and consumer products. But it has also developed a production process specifically for automotive equipment.